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The paper 'Temperature-aware compact SER modeling using model order reduction' was accepted for publication in Microprocessors and Microsystems, Elsevier
The Multi-Partner Project paper 'Collaborative Innovation in 3D VLSI Reliability (COIN-3D)' will be presented at DATE 2026.
The paper 'Compact SER Models for Line-Source-Induced Charge Collection Using Model Order Reduction' was accepted at IEEE DFTS '25.
Compact SER Models for Line-Source-Induced Charge Collection Using Model Order Reduction
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